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    產品列表
    產品圖片 名稱 型號 主要成份 熔點/PH值 粘度/比重 作業溫度 應用 儲存條件
    焊錫膏 ETD-558 錫62.8、鉛36.8、銀0.4 熔點:179-183℃ 粘度:150-190Pa.s 210-230℃ BGA植球、SMT貼裝BGA、防止0402及以下物料立碑 0-10℃
    有鉛錫膏Sn63/Pb37 ETD-557 錫63、鉛37 熔點:183℃ 粘度:150-180Pa.s 210-230℃ 優異電子產品焊接如:機頂盒、音響、藍牙等 0-10℃
    高鉛錫膏Sn5/Pb92.5/Ag2.5 ETD-592 錫5、鉛92.5、銀2.5 熔點:268-290℃ 粘度:130-160Pa.s 330-360℃ 半導體封裝行業 0-10℃
    高鉛錫膏Sn10/Pb90 ETD-590 錫10、鉛90 熔點:275-305℃ 粘度130-160Pa.s 340-360℃ 低成本半導體封裝 0-10℃

    粵公網安備 44030602001479號

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